JPH0621248Y2 - ピングリッドアレイパッケージ用回路基板 - Google Patents
ピングリッドアレイパッケージ用回路基板Info
- Publication number
- JPH0621248Y2 JPH0621248Y2 JP1988112032U JP11203288U JPH0621248Y2 JP H0621248 Y2 JPH0621248 Y2 JP H0621248Y2 JP 1988112032 U JP1988112032 U JP 1988112032U JP 11203288 U JP11203288 U JP 11203288U JP H0621248 Y2 JPH0621248 Y2 JP H0621248Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- grid array
- array package
- pin
- pin grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112032U JPH0621248Y2 (ja) | 1988-08-26 | 1988-08-26 | ピングリッドアレイパッケージ用回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112032U JPH0621248Y2 (ja) | 1988-08-26 | 1988-08-26 | ピングリッドアレイパッケージ用回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233441U JPH0233441U (en]) | 1990-03-02 |
| JPH0621248Y2 true JPH0621248Y2 (ja) | 1994-06-01 |
Family
ID=31350611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988112032U Expired - Lifetime JPH0621248Y2 (ja) | 1988-08-26 | 1988-08-26 | ピングリッドアレイパッケージ用回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621248Y2 (en]) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787220B2 (ja) * | 1986-06-02 | 1995-09-20 | 日立電線株式会社 | Ｐｇａ用基板の製造方法 |
-
1988
- 1988-08-26 JP JP1988112032U patent/JPH0621248Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0233441U (en]) | 1990-03-02 |
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